RoHS Quality Statement
R&D Circuits certifies that all direct materials used in the fabrication of the printed circuit boards have been tested and/or verified by our suppliers and found to be compliant with the requirements of RoHS standard EEC Directive 2002/95/EC.
Following is a listing of our laminates that are compatible with the elevated lead-free soldering temperatures:
• FR4 Nelco N4000-6 (Not recommended for extended dwell or multiple thermal excursions)
• FR4 Nelco N4000-ll
• FR4 Nelco N4000-13
• FR4 Nelco N4000-13 SI
• BT Epoxy Nelco N5000
• Polyimide Nelco N7000
• Cyanate Ester Nelco N8000
• Rogers, High Frequency Materials & Flex materials—complete series
• Arlon, Microwave Materials & Electronic Substrates—complete series
• Taconic, Advanced Dielectrics—complete series
• DuPont Pyralux LF, FR (adhesive and cover lay)
• DuPont Pyralux AP (core)
• Gore, Bonding Materials
As an alternative to solder coating, we offer a variety of lead-free finishes including:
• Electrolytic hard gold: Technic 80RC
• Electrolytic soft gold: Technic ACR 434
• *Electrolytic gold srtike: Technic Orostrike C
• Immersion silver: Technic Argentomerse
• Immersion tin: Florida CirTech Omikron OA8
• ENIG: OMG Fidelity
• OSP: Enthone Entek