Fabrication Capabilities Matrix

Board Features	Standard	Premium	Advanced	Cutting Edge
Laser Drilling/Routing with Vision
Lines and Spaces (Outer)	.006"	.005" - .003"	.002"	.001"
Lines and Spaces (Inner)	.006"	.005" - .003"	.002"	.001"
Out Annual Ring (Over Drill Size)	.007"	.006" - .003"	< .003"	.0000000"
Inner Annual Ring (Hole to Plane Clearance or Conductor)	.005"	.004" - .003"	< .003"	.000" / build up
Layer to Layer Registrations (Core to Core)	.005"	.004" - .003"	< .002"	Material Dependant
Layer to Layer Registration (Top to Bottom)	.005"	.004" - .003"	.002"
PCB Thickness Tolerance	10%	9% - 5%	.002"
Mechanical Drill Hole Minimum	.016"	.0145" - .0059"	.004"
Lasser Drilled Holes	.006"	.005" - .002"	.001"
Aspect Ratio (= / > than .015")	9:1	10:1 - 16:1	17:1 - 21:1	22:1 - 37:1
Controlled Impedance Characteristic	10%	9% - 5%	1 Ohm
Differential	10%	9% - 5%
LPI Soldermask (Dams)	.005"	.004" - .003"	.002"
Other Board Information
Layer Count	40+
Panel Sizes	12 x 18, 18 x 24, 20 x 24, 20 x 26
Max Board Thickness	.350"
Min Board Thickness (Dielectric Thickness)	.001"

Materials

FR4 (Di, Multi, Tetra-functional)
High Temp FR4 (Di, Multi, Tetra-functional)
G200
G-tech
Polyimide
Resin Coated Foil
Thermount (Polyimide)
Thermount (Epoxy)
BT
Glass Re-enforced Ceramic
PTFE Woven (D/S & Hybrid MLB)
PTFE Non-Woven (D/S & Hybrid MLB)
PTFE Ceramic (D/S & Hybrid MLB)
Speed Board C Prepreg
Speed Board N Prepreg
Full Array of Bonding Films
Flex (Capton-Upilex/LPI Covercoats)

Material Processing

Omega Ply Buried Resistors
Copper Invar Copper Metal Cors
Heat Sinks (Brass, Copper & Aluminum)
Hole Filled (Platedover)
CB100 Silver Fill
SD2361 Epoxy Fill

Surface Finishes

Solder Level
OSP
Immersion Silver
Immersion Gold
Electrolytic Hard Gold (Knoop Hardness 120 or greater)
Soft Electrolytic Gold (Knoop Hardness 90 or less)
Electrolytic Nickel
Electroless Nickel
Immersion Tin
Carbon Coating