High Density Interconnect

As technology pushes forward, the demands for smaller packages and higher routing densities become a challenge for both designers and manufacturers. R&D Circuits has become an industry leader in providing HDI products to their customers on a quick turn, high quality basis. R&D has put in place all the tools nessesary to design, fabricate and assemble such demanding product.

R&D utilizes it's 3rd harmonic Yag laser for drilling micro vias down to 2 mil (.002"), and R&D utilizes it's Tamarak Collimated exposing Light and it's Liquid Electrophoritic resist to image fine lines down to 1 mil (.001").

With approximately 120 to 130 electrical connections per square inch located on both sides of the board, hole size, trace width, space width and pad size become important considerations during the design phase. R&D designers implement design rule checks while designing such complex boards, ensuring that the board is manufacturable.

Virtually any material can be incorporated into a HDI design, including flexible materials. R&D has experience with a wide array of exotic materials and can help you in choosing the right type for your design, taking into account impedance and high speed performance. Please contact a R&D sales engineer for material recommendations on your next project.