High Speed
High Speed Simulation
R&D employs a staff of two full time microwave engineers, utilizing the latest Ansoft software for true 3D circuit simulation and optimization. This includes 3D modeling, 3Dmeshing, full wave finite element analysis, 3D post processing / field visualization, planar 3D electromagnetic simulation, integrated schematic & layout capability, DXF, Gerber and GDSII importing and optometric.CAM / Engineering
Polar impedance calculators and stack-up generator, for surface microstrip, coated micro strip, embedded microstrip, symetrical stripline, offset stripline, edge coupled symetrical stripline, edge coupled offset stripline, broad-side coupled stripline, surface co-planar line, coated co-planar line,embeded co-planar line,offset co-planar stripline and more...Imaging
Collimated light source for superior line definition. Liquid electrophoritic photo resist, .0002" thick for true 1:1 transmition line reproduction, with straight side walls.Etching
Ultra fine line etched with computer controlled ball valves on each nozzele for,"pattern-dependent" etching with straight side walls.Lamination
High temp. (800deg.F) lamination presses for teflon fusion bonding, and other high performance, high speed bonding materials which require tempatures from 400 deg. F to 800 deg. F.Periodic Reverse Pulse Plating
Electrolytic copper plating for pattern and panel plating which pulses the current, thereby accentuating the high current density areas . Then periodically reverses the pulsed current, removing copper ions from the high current density areas, effectively leveling the copper across the board plane. This creates an extremely consistent etch rate across the panel and provides for much greater impedance control.Coaxial PCB traces
R&D has developed a patent pending process by which a printed pcb trace can be totally encapsulated on all four sides with ground reference, providing a true coaxial transmition line.These transmition line can be incoporated into multilayer printed circuit boards utilizing a large range of materials. This technology is idealy suited for 10 gig, (and beyond) high-speed back planes.